Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

Xu, H; Liu, C; Silberschmidt, V V; Pramana, Stevin S; White, Timothy; Chen, Z; Acoff, V L

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Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

Date

2011

Authors

Xu, H

Liu, C

Silberschmidt, V V

Pramana, Stevin S

White, Timothy

Chen, Z

Acoff, V L

Publisher

Pergamon Press

Abstract

Nanoscale interfacial evolution in Cu-Al wire bonds during isothermal annealing from 175 °C to 250 °C was investigated by high resolution transmission electron microscopy (HRTEM). The native aluminum oxide film (∼5 nm thick) of the Al pad migrates tow

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http://hdl.handle.net/1885/68206

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Open Access Research

Source

Acta Materialia

Type

Journal article

DOI

10.1016/j.actamat.2011.05.041

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2037-12-31

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Behavior of aluminum oxide, intermetallics and voids in Cu-Al wire bonds

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